发明名称 |
DEVICE AND METHOD FOR TREATING WAFER-SHAPED ARTICLES |
摘要 |
<p>A method and device for processing wafer-shaped articles comprises a closed process chamber. A rotary chuck is located within the process chamber, and is adapted to hold a wafer shaped article thereon. An interior fluid distribution ring is positioned above the rotary chuck, and comprises an annular surface inclined downwardly from a radially inner edge to a radially outer edge thereof. At least one fluid distribution nozzle extends into the closed process chamber and is positioned so as to discharge fluid onto the annular surface of the fluid distribution ring.</p> |
申请公布号 |
SG11201401991P(A) |
申请公布日期 |
2014.08.28 |
申请号 |
SG11201401991P |
申请日期 |
2012.11.23 |
申请人 |
LAM RESEARCH AG |
发明人 |
TSCHINDERLE, ULRICH;BRUGGER, MICHAEL;GLEISSNER, ANDREAS |
分类号 |
H01L21/67 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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