Multilayer electronic structures with vias having different dimensions

摘要

A multilayer composite electronic structure comprising at least two feature layers extending in an X-Y plane and separated by a via layer comprising a dielectric material that is sandwiched between two adjacent feature layers, the via layer comprising via posts that couple adjacent feature layers in a Z direction perpendicular to the X-Y plane, wherein a first via has different dimensions in the X-Y plane from a second via in the via layer.

主权项

1. A multilayer electronic interconnect support structure for coupling to a chip, comprising at least two feature layers extending in an X-Y plane and separated by a via layer comprising a dielectric material comprising a polymer matrix that is sandwiched between two adjacent feature layers, the via layer comprising a plurality of via posts that couple adjacent feature layers in a Z direction perpendicular to the X-Y plane, wherein a first via post in the via layer has different dimensions in the X-Y plane from a second via post in the via layer.