Disk with an electrical connection element

摘要

A pane with an electrical connection element is described, including a substrate made of glass with a first coefficient of thermal expansion, an electrically conductive structure with a layer thickness of 5 μm to 40 μm on a region of the substrate, a connection element with a second coefficient of thermal expansion, and a layer of a solder material that connects the connection element electrically to subregions of the electrically conductive structure.

主权项

1. A pane, comprising:
a substrate made of glass having a first coefficient of thermal expansion; an electrically conductive structure with a layer thickness of 5 μm to 40 μm on a region of the substrate; a connection element having a second coefficient of thermal expansion, wherein the difference between the first coefficient of expansion and the second coefficient of expansion is <5×10−6/° C.; and a layer of a solder material electrically connecting the connection element to subregions of the electrically conductive structure, the connection element comprising 50 wt.-% to 75 wt.-% iron, 25 wt.-% to 50 wt.-% nickel, 0 wt.-% to 20 wt.-% cobalt, 0 wt.-% to 1.5 wt.-% magnesium, 0 wt.-% to 1 wt.-% silicon, 0 wt.-% to 1 wt.-% carbon, and 0 wt.-% to 1 wt.-% manganese.