Imaging methods

摘要

A method is provided for imaging a region of interest. The method includes defining a lamella within a microelectronic device, where the region of interest is in the lamella. The lamella has a first and second surface, and a first sacrificial layer contacts the first surface. The region of interest includes a material of interest, and an imaging technique capable of detecting the material of interest is selected. A support layer is formed on the second surface, where the support layer is transparent to the imaging technique. The first sacrificial layer is removed, and an image of the region of interest is produced.

主权项

1. A method of imaging, the method comprising:
defining a lamella within a microelectronics device, wherein the lamella comprises a region of interest, a first surface, and a second surface opposite the first surface, wherein the microelectronics device comprises a first sacrificial layer contacting the first surface and a second sacrificial layer contacting the second surface, and wherein the region of interest comprises a material of interest; selecting a transmission electron microscope imaging technique capable of detecting the material of interest; removing the lamella, the first sacrificial layer, and the second sacrificial layer from the microelectronics device; removing the second sacrificial layer from the second surface; forming a support layer on the second surface after removing the second sacrificial layer from the second surface, wherein the support layer comprises a material transparent to the transmission electron microscope imaging technique; removing the first sacrificial layer after forming the support layer; and producing an image of the region of interest with the transmission electron microscope.