发明名称 Semiconductor device and method for manufacturing semiconductor device
摘要 Disclosed is a semiconductor device (10) which comprises a glass substrate (12), a lower electrode layer (14), an n-type doped polycrystalline silicon semiconductor layer (16), a low-temperature insulating film (20) in which openings (22, 23) that serve as nuclei for growth of a nanowire (32) are formed, the nanowire (32) that is grown over the low-temperature insulating film (20) and has a core-shell structure, an insulating layer (50) that surrounds the nanowire (32), and an upper electrode layer (52). The nanowire (32) comprises an n-type GaAs core layer and a p-type GaAs shell layer. Alternatively, the nanowire can be formed as a nanowire having a quantum well structure, and InAs that can allow reduction of the process temperature can be used for the nanowire.
申请公布号 US8816324(B2) 申请公布日期 2014.08.26
申请号 US201113581242 申请日期 2011.02.23
申请人 National University Corporation Hokkaido University;Sharp Kabushiki Kaisha 发明人 Fukui Takashi;Tomioka Katsuhiro;Motohisa Junichi;Hara Shinjiroh
分类号 H01L29/06 主分类号 H01L29/06
代理机构 Birch, Stewart, Kolasch & Birch, LLP 代理人 Birch, Stewart, Kolasch & Birch, LLP
主权项 1. A semiconductor device, comprising: a glass or film-like substrate; a polycrystalline silicon semiconductor layer formed with a (111)-plane parallel to a plane of the substrate; an insulating film with openings which covers the (111)-plane of the polycrystalline silicon semiconductor layer and in which a plurality of openings having a smaller area than an area of crystal grain of polycrystalline silicon over the (111)-plane are formed; and a plurality of nanowires which are formed of a III-V family compound semiconductor and which extend vertical to the (111)-plane of the polycrystalline silicon semiconductor layer at the opening of the insulating film with openings serving as a nucleus.
地址 Hokkaido JP