SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus and a semiconductor device manufacturing method, which can perform exposure on a semiconductor substrate in a manner such that deformation is not caused in a pattern exposed when the semiconductor substrate returns to a state without deformation even when the semiconductor substrate is exposed in a state with deformation.SOLUTION: A semiconductor manufacturing apparatus according to the present embodiment comprises: a vacuum chamber; a stage for mounting a semiconductor substrate in the vacuum chamber; an electrostatic chuck for fixing the semiconductor substrate on the stage; a sensor for detecting a height of a surface of the semiconductor substrate fixed on the stage by the chuck; a calculation part for determining whether a surface of the semiconductor substrate has deformation based on the height of the surface of the semiconductor substrate, and calculating a correction value of a pattern exposed on the surface of the semiconductor substrate based on the height of the surface of the semiconductor substrate when it is detected that the surface of the semiconductor substrate has deformation; and an exposure part for exposing the surface of the semiconductor substrate by using the correction value.