| 摘要 |
PROBLEM TO BE SOLVED: To provide a filler which improves the cooling efficiency of a cooling device, and to provide the cooling device including the filler.SOLUTION: A filler 22 for a cooling device is installed in a cooling device 100 to be used for conducting heat exchange between a heat medium flowing on a surface and air and has a heat exchange part 28 along which the heat medium flows. A surface of the heat exchange part has a shape formed by combining multiple wavy surfaces. The multiple wavy surfaces include large wavy surfaces 34 and small wavy surfaces 42 combined on each large wavy surface. A pitch p1 of the large wavy surface is larger than a pitch p2 of the small wavy surface, and the amplitude h1 of the large wavy surface is larger than the amplitude h2 of the small wavy surface. |
