| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method capable of reducing such a risk that foreign matters, e.g., grinding debris and abrasive grains, are retained in a circular recess, when forming the circular recess in the backside of a wafer by grinding.SOLUTION: When grinding a radius area on the backside 1b of a wafer 1 held on a rotating holding table 10 by abutting the grinding grindstones 25 of a grinding wheel 24 arranged annularly against the radius area, to form a circular recess 1c in the backside 1b and an annular protrusion 1d surrounding the circular recess 1c, a foreign matter removal fluid F is supplied into the circular recess 1c from the outside of the grinding wheel 24, separately from the grinding fluid thus discharging the foreign matters, that may be retained in the circular recess 1c, to the outside thereof. |
