发明名称 |
AGGREGATED BORON NITRIDE PARTICLES, COMPOSITION CONTAINING SAID PARTICLES, AND THREE-DIMENSIONAL INTEGRATED CIRCUIT HAVING LAYER COMPRISING SAID COMPOSITION |
摘要 |
To provide a composition for a three-dimensional integrated circuit capable of forming a filling interlayer excellent in thermal conductivity also in a thickness direction, using agglomerated boron nitride particles excellent in the isotropy of thermal conductivity, disintegration resistance and kneading property with a resin. A composition for a three-dimensional integrated circuit, comprising agglomerated boron nitride particles which have a specific surface area of at least 10 m 2 /g, the surface of which is constituted by boron nitride primary particles having an average particle size of at least 0.05 µm and at most 1 µm, and which are spherical, and a resin (A) having a melt viscosity at 120°C of at most 100 Pa·s. |
申请公布号 |
KR20140103106(A) |
申请公布日期 |
2014.08.25 |
申请号 |
KR20147014474 |
申请日期 |
2012.11.29 |
申请人 |
MITSUBISHI CHEMICAL CORPORATION |
发明人 |
YAMAZAKI MASANORI;ABE MARI;MURASE TOMOHIDE;KAWASE YASUHIRO;IKEMOTO MAKOTO;KIRITANI HIDEKI;MATSUSHITA YASUNORI |
分类号 |
C01B21/064;C01B35/08;C08K3/38;C08L63/00;C08L101/00;C09D7/12;C09D201/00 |
主分类号 |
C01B21/064 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|