NON-CONVENTIONAL METHOD OF SILICON WAFER SAWING USING A PLURALITY OF WAFER SAW ROTATIONAL ANGLES

摘要

A silicon wafer saw can be set to either three or four different cutting angle orientations from a zero degree reference to produce integrated circuit dice having corners greater than 90 degrees. Three different saw angle orientations will produce six sided dice, and four different saw cutting angle orientations will produce eight sided dice.