| 摘要 |
<p>A radiation curable adhesive comprising (i) (meth)acrylic monomer(s) and/or oligomer(s), wherein said (meth)acrylic monomers or oligomers comprise 5 to 50 wt % of esters of (meth)acrylic acid with polyetherpolyols having the formula HO-((CH2) m -O)n -X wherein m = 2, 3 or 4; n = 2 to 50; X = H, linear, branched or aromatic C1 to C12- alkyl, the ester having a molecular weight from 150 to 2000 g/mol; (ii) non-reactive (co)polymer(s) based on unsaturated monomers, wherein said unsaturated monomers are selected from vinyl esters, (meth)acrylate esters and C2 to C8 unsaturated olefins, the (co)polymer having a molecular weight from 5000 g/mol to 500000g/mol, such adhesive can form a solid adhesive layer after being cross-linked by radiation, the layer has a non tacky surface but can be adhesively bonded under pressure to a second layer of the adhesive.</p> |
