| 发明名称 |
LIGHT-EMITTING DEVICE PACKAGE |
| 摘要 |
The present application provides a light-emitting device package. The light-emitting device package includes a package substrate includes at least one via hole. A light-emitting device is mounted on the package substrate so as to overlap with the via hole. A bonding layer is formed between the light-emitting device and the package substrate and includes a eutectic bonding material. |
| 申请公布号 |
US2014232293(A1) |
申请公布日期 |
2014.08.21 |
| 申请号 |
US201314082991 |
申请日期 |
2013.11.18 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KAM Dong-hyuck;YONG Gam-han;LEE Sang-hyun;HWANG Seong-deok |
| 分类号 |
H01L33/62;H05B33/08;H01L33/08 |
主分类号 |
H01L33/62 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light-emitting device package, comprising:
a package substrate including at least one via hole; a light-emitting device mounted on the package substrate, the light-emitting device overlapping with the at least one via hole; and a bonding layer formed between the light-emitting device and the package substrate, the bonding layer including a eutectic bonding material. |
| 地址 |
Suwon-si KR |
