| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin-substrate treatment apparatus capable of preventing the temperature of a thin substrate from being raised.SOLUTION: A sputter device 10 includes a film deposition part discharging sputter particles Sp from a target 21 to a film substrate S, and a gas cooling part 31 cooling the film substrate S. The gas cooling part 31 supply cooling gas to the film substrate S, to which the sputter particles Sp are discharged, in a side opposite to the target 21, so as to cool the film substrate S. |
