STRUCTURES FOR Z-AXIS INTERCONNECTION OF MULTILAYER ELECTRONIC SUBSTRATES
摘要
<p>Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.</p>
申请公布号
WO2014127381(A1)
申请公布日期
2014.08.21
申请号
WO2014US16999
申请日期
2014.02.18
申请人
ORMET CIRCUITS, INC.;INTEGRAL TECHNOLOGY, INC.
发明人
HUNRATH, CHRISTOPHER A;TRAN, KHANG DUY;SHEARER, CATHERINE A;HOLCOMB, KENNETH C;FRIESEN, G DELBERT