| 摘要 |
<p>The present invention relates to an IC package and a method for fabricating the same. An IC package according to the present invention includes a PCB having a circuit pattern; a flexible substrate which is mounted on the PCB to be electrically connected to the circuit pattern, and has both ends which are bent in one direction; a first and a second chip stack part which have semiconductor chips which are stacked with a step shape in surfaces facing the inner side of the bent flexible substrate and are electrically connected to the flexible substrate by a bonding wire; a bonding layer which is formed between the first and the second chip stack part; and a molding part which seals one surface of the PCB which includes the first and the second chip stack part.</p> |
