发明名称
摘要 A circuit board unit (61) of an ECU (12) has an upper surface (61a) on which semiconductor elements (77) are installed, a lower surface (61b) that is on the opposite side of the circuit board unit (61) from the upper surface (61a), and a cutout portion (91) that is formed below the upper surface (61a). A power module (62) includes a conductive protruding piece (101) and an electrically insulating main portion (65) that holds the protruding piece (101). The conductive protruding piece (101) is inserted in the cutout portion (91) to support the circuit board unit (61), and is electrically connected to the semiconductor elements (77).
申请公布号 JP5574172(B2) 申请公布日期 2014.08.20
申请号 JP20100159736 申请日期 2010.07.14
申请人 发明人
分类号 H02K11/00;B62D5/04;H05K7/14;H05K7/20 主分类号 H02K11/00
代理机构 代理人
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