Method and appartus for conditioning a polishing pad

摘要

A method of and an apparatus for conditioning a surface of a polishing pad 2 is used for conditioning a polishing pad on a polishing table 1 for polishing a thin film formed on a surface of a substrate W . The conditioning method includes bringing a dresser 22 into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is controlled by a controller 40 to be higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.