发明名称 Printed circuit board and method for manufacturing the same
摘要 The present invention relates to a printed circuit board and a method for manufacturing the same. The printed circuit board according to one embodiment of the present invention includes a unit substrate having a step difference part; a combination part having a bonding surface; and a pair of support members which includes a dummy part connected to the combination part. According to the embodiment of the present invention, the support member includes a connection part which connects the combination part and the dummy part.
申请公布号 KR101432390(B1) 申请公布日期 2014.08.20
申请号 KR20120150943 申请日期 2012.12.21
申请人 发明人
分类号 H01L23/12;H01L23/48;H05K1/11 主分类号 H01L23/12
代理机构 代理人
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