发明名称
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor substrate capable of forming a semiconductor element having favorable crystallinity and high performance. SOLUTION: A single-crystal semiconductor substrate having a brittle layer is bonded to a base substrate via an insulating layer; the single-crystal semiconductor substrate is separated with the brittle layer as a boundary by heat treatment; a single-crystal semiconductor layer is fixed on the base substrate; and laser beams are applied to the single-crystal semiconductor layer for turning the single-crystal semiconductor layer into a partially melted state for recrystallization and recovering crystal defects. In concentration distribution in the depth direction of the single-crystal semiconductor layer after the recrystallization, a carbon concentration has the local maximum. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP5576617(B2) 申请公布日期 2014.08.20
申请号 JP20090062728 申请日期 2009.03.16
申请人 发明人
分类号 H01L27/12;H01L21/02;H01L21/20;H01L21/336;H01L29/786 主分类号 H01L27/12
代理机构 代理人
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