Semiconductor device and method for making the same using semiconductor fin density design rules

摘要

A method for designing a semiconductor ic chip includes dividing the chip into functional blocks such as a core portion and one or more other functional cells and applying design rules concerning the spatial arrangement of semiconductor fins to the core portion but not to the other functional cells. The design guidelines include the application of design rules to some but not all functional blocks of the chip, may be stored on a computer-readable medium and the design of the semiconductor ic chip and the generation of a photomask set for manufacturing the semiconductor ic chip may be carried out using a CAD or other automated design system. The semiconductor ic chip formed in accordance with this method includes semiconductor fins that are formed in both the core portion and the other functional cells but are only required to be tightly packed in the core portion.

主权项

1. An integrated circuit comprising:
at least one core device portion and at least one dense component cell; and a plurality of semiconductor fins including: core semiconductor fins disposed in said at least one core device portion and arranged according to a design rule requiring a minimum packing density of said core semiconductor fins; and further semiconductor fins disposed in said at least one dense component cell but not arranged in accordance with said design rule, wherein said at least one dense component cell includes a first dense component cell with no more than a single one of said further semiconductor fins disposed therein.