Method for surface treatment of copper and copper

摘要

An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.

主权项

1. A copper surface treatment method, comprising:
a first step of forming, on a copper surface, a nobler metal than the copper discretely, a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent, a next third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface, and a fourth step of subjecting the copper surface to a treatment for improving the bonding strength thereof after the third step, wherein the fourth step includes at least one treatment selected from the group consisting of a treatment for forming a baser metal than copper onto the copper surface and a treatment with a solution containing an azole compound.