发明名称 Semiconductor device and a manufacturing method thereof
摘要 The performances of a semiconductor device are improved. The device includes a first MISFET in which hafnium is added to the gate electrode side of a first gate insulation film including silicon oxynitride, and a second MISFET in which hafnium is added to the gate electrode side of a second gate insulation film including silicon oxynitride. The hafnium concentration in the second gate insulation film of the second MISFET is set smaller than the hafnium concentration in the first gate insulation film of the first MISFET; and the nitrogen concentration in the second gate insulation film of the second MISFET is set smaller than the nitrogen concentration in the first gate insulation film of the first MISFET. As a result, the threshold voltage of the second MISFET is adjusted to be smaller than the threshold voltage of the first MISFET.
申请公布号 US8809959(B2) 申请公布日期 2014.08.19
申请号 US201213693351 申请日期 2012.12.04
申请人 Renesas Electronics Corporation 发明人 Yoshimori Hiromasa;Shinohara Hirofumi;Iwamatsu Toshiaki
分类号 H01L27/088 主分类号 H01L27/088
代理机构 Foley & Lardner LLP 代理人 Foley & Lardner LLP
主权项 1. A semiconductor device comprising a first MISFET and a second MISFET formed over a semiconductor substrate, the first MISFET comprising: a first gate insulation film including a first lower layer film including silicon, oxygen, and nitrogen formed over the semiconductor substrate, and a first upper layer film including hafnium formed over the first lower layer film; and a first gate electrode formed over the first gate insulation film, and the second MISFET comprising: a second gate insulation film including a second lower layer film including silicon, oxygen, and nitrogen formed over the semiconductor substrate, and a second upper layer film including hafnium formed over the second lower layer film; and a second gate electrode formed over the second gate insulation film, wherein the concentration of hafnium in the second upper layer film is smaller than the concentration of hafnium in the first upper layer film, and wherein the concentration of nitrogen in the second lower layer film is smaller than the concentration of nitrogen in the first lower layer film, wherein both of the first MISFET and the second MISFET are of a p channel type.
地址 Kanagawa JP