| 摘要 |
The present invention relates to a laser glass substrate cutting system and a glass substrate cutting method using same. According to the present invention, provided is a laser glass substrate cutting system including: a loading device that loads a glass disk onto the laser glass substrate cutting system; an alignment device that aligns a position of the loaded glass disk; a scribing device that forms a scribing line in the glass disk along a line to be cut; a braking device that cuts the glass disk into multiple unit cells along the scribing line which is formed in the glass disk; a hole processing device that forms a hole in the cut unit cell; an unloading device that unloads the cut and hole-processed unit cell out of the laser glass substrate cutting system; a transport device that transports the glass disk or the unit cell to a device for the subsequent process for the subsequent process; and a control device that controls operations of the loading device, the alignment device, the scribing device, the braking device, the hole processing device, and the unloading device, in which the scribing device forms the scribing line in a linear portion after forming the scribing line in corner areas of the multiple unit cells. Also, provided is a glass substrate cutting method using the same. |
