OPTICAL DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

The present invention relates to an optical device for improving adhesion between an encapsulation material and a metal substrate and a method for manufacturing the same, the method comprising the steps: preparing a metal substrate having a vertical insulating layer; forming a metal plating layer on the upper surface of the metal substrate excluding the vertical insulating layer; a forming one or more processed grooves such that metal substrate is exposed on a part of the metal plating layer which is formed on both sides of the vertical insulating layer; attaching an optical element chip on one side of the metal plating layer with respect to the vertical insulating layer, wherein one electrode of the optical element chip is electrically connected to the metal plating layer, which is an attachment surface, by wire or solder, and the rest of the electrodes are connected to the other surface of the metal plating layer with respect to the vertical insulating layer by wire; and shielding the optical element chip and the surroundings of the optical element chip with the encapsulation material such that the encapsulation material is inserted into and fills at least the processed grooves.