| 发明名称 |
WIRING BOARD AND LIGHT EMITTING DEVICE |
| 摘要 |
There is provided a wiring board. The wiring board includes: a first insulating layer; a plurality of wiring patterns on the first insulating layer so as to be spaced apart from each other; a plating layer on at least one of the wiring patterns; a second insulating layer containing silicone therein and having an opening, wherein an outermost surface of the plating layer is exposed from the opening and serves as a connection pad; and a silica film on the outermost surface of the plating layer. |
| 申请公布号 |
US2014226346(A1) |
申请公布日期 |
2014.08.14 |
| 申请号 |
US201414177599 |
申请日期 |
2014.02.11 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
KOBAYASHI Kazutaka;AIZAWA Mitsuhiro;SHIMIZU Hiroshi;IWAI Mina |
| 分类号 |
F21V19/00;H05K1/02 |
主分类号 |
F21V19/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wiring board comprising:
a first insulating layer; a plurality of wiring patterns on the first insulating layer so as to be spaced apart from each other; a plating layer on at least one of the wiring patterns; a second insulating layer containing silicone therein and having an opening, wherein an outermost surface of the plating layer is exposed from the opening and serves as a connection pad; and a silica film on the outermost surface of the plating layer. |
| 地址 |
Nagano-shi JP |
