| 发明名称 |
PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A package includes a chip that has a metal-insulator-metal (MIM) capacitor formed in a first polymer layer and a metallic pillar formed on the MIM capacitor. A molding compound surrounds the chip, a second polymer layer is formed on the chip and the molding compound, a third polymer layer is formed on the second polymer layer, an interconnect structure is formed between the second polymer layer and the third polymer layer and electrically coupled to the metallic pillar and the MIM capacitor, and a bump is formed over and electrically coupled to the interconnect structure. |
| 申请公布号 |
US2014225222(A1) |
申请公布日期 |
2014.08.14 |
| 申请号 |
US201313764197 |
申请日期 |
2013.02.11 |
| 申请人 |
MANUFACTURING COMPANY, LTD. TAIWAN SEMICONDUCTOR |
发明人 |
YU Chen-Hua;HOU Shang-Yun;CHIOU Wen-Chih;HUNG Jui-Pin;YEH Der-Chyang;YEH Chiung-Han |
| 分类号 |
H01L49/02;H01L21/82 |
主分类号 |
H01L49/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package comprising:
a chip comprising a metal-insulator-metal (MIM) capacitor formed in a first polymer layer and a metallic pillar formed on the MIM capacitor; a molding compound surrounding the chip; a second polymer layer formed on the chip and the molding compound; a third polymer layer formed on the second polymer layer; an interconnect structure formed between the second polymer layer and the third polymer layer and electrically coupled to the metallic pillar and the MIM capacitor; and a bump formed over and electrically coupled to the interconnect structure. |
| 地址 |
US |
