| 摘要 |
PROBLEM TO BE SOLVED: To provide a module which includes a shield layer having an opening and prevents an end surface of the shield layer from being exposed in the opening to make the shield layer less likely to be peeled and achieve excellent reliability.SOLUTION: A module 10 includes a circuit board 1. Electronic components 2, 3, and 4 are mounted on one main surface of the circuit board 1. The mounted electronic components 2, 3, and 4 are sealed by a sealing resin 5. A top surface and a side surface of the sealing resin 5 are covered with a shield layer 6. An opening 6a is formed above the electronic component 4 in the shield layer 6. The sealing resin 5 includes a protruding part 5a at an upper part. The protruding part 5a is exposed from the opening 6a. An end surface of the shield layer 6 in the opening 6a is covered with the protruding part 5a of the sealing resin 5. |
