| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a heat dissipation substrate in which thermal conductivity is enhanced between a member and a thermally conductive interface material layer.SOLUTION: The size of thermally conductive particles is set for a heat dissipation member having an uneven surface where recesses are formed (step 11). The uneven surface of the heat dissipation member is then coated with the thermally conductive particles having a selected size. The thermally conductive particles are embedded in the recesses on the uneven surface of the heat dissipation member with good performance, and the upper part other than the recesses is also coated (step 12). Subsequently, the thermally conductive particles applied to protrude to a part of the uneven surface other than the recesses is removed. As a result, the thermally conductive particles remain only in the recesses on the uneven surface (step 13). Finally, the thermally conductive particles remaining only in the recesses on the uneven surface are coated with a thermally conductive interface material layer (step 14).</p> |
