摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation structure of a circuit board which inhibits temperature rise of electronic components mounted on the circuit board. ! SOLUTION: A heat radiation structure of a circuit board includes: an electronic component 1 which generates heat; first and second circuit boards 10, 20, at least one of which allows the electronic component 1 to be mounted thereon; and a holding terminal 3 for holding the first and second circuit boards 10, 20. The first and second circuit boards 10, 20 include ground layers 13, 23 which contact with the holding terminal 3. Thus, heat generated from the electronic component 1 is transmitted to the second circuit board 20 through the ground layer 23 and is further transmitted from the second circuit board 20 to the first circuit board 10 through the holding terminal 3. Thus, the structure efficiently radiates heat in a wide range. ! COPYRIGHT: (C)2014,JPO&INPIT |