| 摘要 |
<p>PURPOSE: An apparatus for making a temperature uniform and equipment for fabricating a semiconductor device using the same are provided to apply a heat spreader driven by a gas-liquid phase change heat transfer mechanism to a device for making a temperature uniform in a semiconductor deposition device, thereby making temperature distribution in the wafer uniform. CONSTITUTION: A chamber(100) provides a vacuum internal condition. A heater(102) is installed in the upper part of the chamber. A holder(105) supports a wafer(104) at a location facing the heater in the chamber. A heat spreader(103) is arranged between the heater and the wafer. The heat spreader makes a heat flux generated in the heater uniform by a gas-liquid phase change.</p> |
