发明名称 METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE PRODUCT AND ETCHING METHOD UTILIZED THEREIN
摘要 <p>A method of producing a semiconductor substrate product, the method containing: a step of preparing an aqueous solution containing 7% by mass or more and 25% by mass or less of a quaternary alkyl ammonium hydroxide; a step of preparing a semiconductor substrate having a silicon film comprising a polycrystalline silicon film or an amorphous silicon film; and a step of heating the aqueous solution at 80° C. or higher and applying the resultant aqueous solution onto the semiconductor substrate to etch at least a part of the silicon film.</p>
申请公布号 KR20140099955(A) 申请公布日期 2014.08.13
申请号 KR20147020565 申请日期 2012.12.26
申请人 FUJIFILM CORPORATION 发明人 ENOKIDO MASASHI;INABA TADASHI;MIZUTANI ATSUSHI
分类号 H01L21/306;H01L21/308;H01L21/8242;H01L27/108 主分类号 H01L21/306
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