Bond pad monitoring structure and related method of detecting significant alterations

摘要

A passive bond pad condition sense structure may be configured to be electrically stimulated and tested for detecting an anomalous or altered electrical characteristic caused by stress or aging of the bond pad capacitively coupled to it. The related bond pad condition testing or monitoring system may include relatively simple stimulating and sensing circuits that may be wholly embedded in the integrated circuit device.

主权项

1. A bond pad condition sense structure in an integrated circuit device comprising:
a bond pad; a patterned portion of a metal layer of the integrated circuit device wherein wirings of the integrated circuit are defined, coincident with a footprint area of said bond pad, having defined therein at least one interconnected first portion coupled to a node of the integrated circuit device, and to be externally accessible through a device pin coupled to said bond pad, and at least one interconnected second portion, interleaved with said at least one interconnected first portion and electrically isolated therefrom; a dielectric inter-metal isolation layer over said patterned portion; and a plurality of metal interconnects through said dielectric inter-metal isolation layer contacting said at least one interconnected first portion; said bond pad defined in an upper metal layer over said dielectric inter-metal isolation layer, coupled to said at least one interconnected second portion by said plurality of metal interconnects, and capacitively coupled to said at least one interconnected second portion.