| 摘要 |
In the present invention, in-plane variation in the total thickness of a bonded laminate is improved by using an inexpensive device configuration. A center-aligned second disk (W2) is held face-to-face above a first disk (W1) which is evenly coated with an adhesive on the top surface and is supported on a stage (50), and a compression disk (60), which has been center-aligned with the first disk (W1) and the second disk (W2), is used to apply a uniform force to the top surface of the second disk (W2) so as to bond the first disk (W1) and the second disk (W2) together in order to produce a disk laminate. The diameter of the compression disk (60) is set to a size at which the roughness mode in the thickness profile of the disk laminate in the radial direction can be optimized. |
