发明名称 |
DIE FOR ELECTROTYPE AND METHOD OF ITS FABRICATION |
摘要 |
FIELD: process engineering.SUBSTANCE: invention relates to production of die for fabrication of mechanical parts by electrotype. Proposed method comprises deposition of current conducting layer on top and bottom surfaces (20, 22) of substrate (21) made of silicon-based material. Said plate is secured to substrate (23) with the help of adhesive layer. One part (26) of conducting layer is removed from top surface of plate (21). Plate is etched unless conducting layer (22) is removed at bottom surface and at part of die (26) removed from conducting layer (22) at its top surface for making of at least one cavity (25) in the die.EFFECT: higher precision of micromechanical parts with several levels and/or high pliability.19 cl, 13 dwg |
申请公布号 |
RU2525004(C2) |
申请公布日期 |
2014.08.10 |
申请号 |
RU20100109439 |
申请日期 |
2010.03.12 |
申请人 |
NIVAROKS-FAR SA |
发明人 |
KJUZEN,P'ER;GOL'F'E,KLEHR;T'EBO,ZHAN-FILIPP |
分类号 |
C25D1/00;C25D1/10 |
主分类号 |
C25D1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|