THIN SUBSTRATE PROCESSING DEVICE

摘要

A thin substrate processing device (10) is provided with substrate processing units (20A, 20B) that process thin substrates (S) and cooling units (31, 101) that cool the thin substrates (S) during processing of the thin substrates (S) by the substrate processing units (20A, 20B). The cooling units (31, 101) are constituted of an electrostatic chuck (31) that cools the thin substrates (S) by absorbing from a surface on the opposite side from the processing surface of the thin substrates (S) being processed by the substrate processing units (20A, 20B) or a gas cooling unit (101) that cools the thin substrates (S) by supplying a gas to the surface on the opposite side from the processing surface of the thin substrates (S) being processed by the substrate processing units (20A, 20B).