| 发明名称 |
HEAT RADIATION STRUCTURE OF ELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
A heat radiation structure for an electric device includes: at least one multi-layer substrate including a plurality of base parts made of insulation material and a conductor pattern, which are stacked in a multi-layer structure so that the conductor pattern is electrically coupled with an interlayer connection portion in the base parts; the electric device having at least one of a first electric element built in the at least one multi-layer substrate and a second electric element, which is not built in the multi-layer substrate; and a low heat resistance element opposed to the electric device. The low heat resistance element has a heat resistance lower than the insulation material. |
| 申请公布号 |
US2014218869(A1) |
申请公布日期 |
2014.08.07 |
| 申请号 |
US201414167007 |
申请日期 |
2014.01.29 |
| 申请人 |
Denso Corporation |
发明人 |
YAMANAKA Takahiro;HARA Yoshimichi;YAMAMOTO Toshihisa;KAMEYAMA Kouji;KOBAYASHI Yuuji |
| 分类号 |
H05K7/20;H05K3/00;H05K3/30;H05K3/22;H05K3/10 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat radiation structure for an electric device comprising:
at least one multi-layer substrate including a plurality of base parts made of insulation material and a conductor pattern, which are stacked in a multi-layer structure so that the conductor pattern is electrically coupled with an interlayer connection portion in the base parts; the electric device having at least one of a first electric element built in the at least one multi-layer substrate and a second electric element, which is not built in the multi-layer substrate; and a low heat resistance element opposed to the electric device, wherein the low heat resistance element has a heat resistance lower than the insulation material. |
| 地址 |
Kariya-city JP |
