SEMICONDUCTOR DEVICE

摘要

Provided is a semiconductor device configured to prevent a penetration of moisture into an internal circuit. The moisture from a bonding pad to the internal circuit is blocked by providing an underlying polysilicon film (10) formed as a lower layer of a bonding pad, a bonding pad (1) formed above the underlying polysilicon film (10) through intermediation of an inter-layer insulation film (21), and an outer circumferential interconnecting line (3) formed so as to surround an outer side of the bonding pad 1, and by connecting the outer circumferential interconnecting line (3) and the underlying polysilicon film (10) with a continuous outer circumferential contact.

主权项

1. A semiconductor device, comprising:
a semiconductor substrate; an oxide film formed on the semiconductor substrate; an electrically-conductive non-water-permeable film formed on the oxide film; a bonding pad formed above the electrically-conductive non-water-permeable film through intermediation of an inter-layer insulation film, the bonding pad being smaller than the electrically-conductive non-water-permeable film; a metal interconnecting line configured to connect the bonding pad to an internal circuit; an outer circumferential interconnecting line surrounding the bonding pad and formed above the electrically-conductive non-water-permeable film, the being separated from the bonding pad; and a contact formed along an entire circumference of the outer circumferential interconnecting line, the contact electrically connecting the outer circumferential interconnecting line to the electrically-conductive non-water-permeable film and dividing the inter-layer insulation film into an inside portion and an outside portion of the contact.