发明名称 SUBSTRATE FIXING APPARATUS, SUBSTRATE WORKING APPARATUS AND SUBSTRATE FIXING METHOD
摘要 A substrate fixing apparatus includes a back-up member which is located between a pair of conveying members arranged at a distance from each other in a plan view and is below a film-like substrate conveyed along the conveyance path and supported from below by the pair of conveying members. An elevation driver moves at least one of a back-up member and a substrate pressing member upward and downward. The elevation driver elevates the back-up member and/or lowers the substrate pressing member together with the pair of conveying members, thereby separating the substrate upward from the pair of conveying members while supporting the substrate from below by the back-up member and pressing the surface of the outer peripheral part of the substrate downward by the substrate pressing member to correct warpage of the outer peripheral part of the substrate.
申请公布号 US2014215813(A1) 申请公布日期 2014.08.07
申请号 US201414173577 申请日期 2014.02.05
申请人 YAMAHA HATSUDOKI KABUSHIKI KAISHA 发明人 KISHIMOTO Youhei
分类号 H05K13/08 主分类号 H05K13/08
代理机构 代理人
主权项 1. A substrate fixing apparatus comprising: a back-up member located between a pair of conveying members arranged at a distance from each other and below a film-like substrate conveyed along a conveyance path, the film-like substrate being supported from below by the pair of conveying members; and a substrate pressing member, an elevation driver moving at least one of the back-up member and the substrate pressing member upward and downward, the elevation driver elevating the back-up member and/or lowering the substrate pressing member, thereby separating the film-like substrate from the pair of conveying members while supporting the film-like substrate from below by the back-up member and pressing a surface of an outer peripheral part of the film-like substrate downward by the substrate pressing member to correct warpage of the outer peripheral part of the substrate.
地址 Iwata-shi JP