Method and Apparatus for a Wafer Seal Ring

摘要

A wafer seal ring may be formed on a wafer having a pattern structure with a pattern density. The wafer seal ring pattern structure may include a plurality of lines having a width and a spacing that may be approximately equal to a width and a spacing of die bond rings on the wafer. The wafer having the wafer seal ring formed thereon may be bonded to a wafer that may not have a wafer seal ring. A pair of wafers may be formed with respective wafer seal rings formed in a corresponding manner. The pair of wafers may be bonded together with the wafer seal rings aligned and bonded together to form a seal ring structure between the bonded wafers.

主权项

1. A method comprising:
forming a first plurality of dies on a first wafer in a die area of the first wafer; forming a first plurality of die bond rings on the first wafer, the first plurality of die bond rings having a first width and a first spacing; and forming a first wafer seal ring on the first wafer in a seal ring area of the wafer, the first wafer seal ring having a plurality of lines having a second width and a second spacing, wherein a cross-section of the first width and the first spacing of the first plurality of die bond rings is approximately equal to the second width and the second spacing of the first wafer seal ring.