METHOD FOR PRODUCING MODULE SUBSTRATE AND ELECTRONIC DEVICE

摘要

Provided is a method for producing a module substrate, which is capable of preventing breakage of a component mounted on a substrate. This method for producing a module substrate uses a substrate (1) on which at least one component (2) is mounted, a thermosetting resin sheet and a thickness adjusting jig (21); and the thermosetting resin sheet has a first opening and the thickness adjusting jig has a second opening. This method for producing a module substrate comprises: a step wherein the substrate and the thermosetting resin sheet are overlapped with each other so that the component is contained in the first opening; and a step wherein the thermosetting resin sheet and the thickness adjusting jig are overlapped with each other so that the first opening and the second opening face each other.