POLISHING APPARATUS

摘要

An object of the present invention is to improve the capability of lifting a substrate with the polishing performance of the substrate maintained. A polishing apparatus 100 includes a polishing table 110 to which a polishing pad 108 for polishing a substrate 102 is attached, a liquid feeding section configured to feed a liquid 109 to a polishing surface of the polishing pad 108, a top ring 116 configured to suck and convey the substrate 102 from the polishing surface, the substrate 102 being disposed on the polishing surface via the liquid 109 fed by the liquid feeding section, and a control section configured to inject a fluid (N2) into an internal area 109a of the liquid 109 interposed between the substrate 102 and the polishing pad 108.

主权项

1. A polishing apparatus comprising:
a polishing table to which a polishing pad for polishing a substrate is attached; a liquid feeding section configured to feed a liquid to a polishing surface of the polishing pad; a substrate holding section configured to suck and convey the substrate from the polishing surface, the substrate contacting the polishing surface via the liquid fed by the liquid feeding section; and a control section configured to inject a fluid between the substrate and the polishing pad when the substrate is being conveyed.