| 摘要 |
A manufacturing method of a light emitting diode package structure (200) is disclosed. First, a carrier (210) and an LED chip (220) are provided, wherein the LED chip is disposed on the carrier and located in a cavity. Next, a first molding compound (230) is filled into the cavity, wherein the first molding compound overlays the LED chip and the first molding compound is mixed up with a fluorescent material (232). Then, a first baking process to make the first molding compound in semi-cured state is conducted. After that, a second molding compound (240) is filled into the cavity, wherein the second molding compound overlays the first molding compound. |
