| 摘要 |
The present invention relates to a method of mounting a COB-type chip package onto a metal card. The method includes step (a) of cutting a printed circuit board, on which a plurality of COB-type chip packages are formed, using a cutting mold and forming a single COB-type chip package; step (b) of etching a certain area of the main body of a metal card to form a chip insertion groove; and step (c) of inserting and attaching the COB-type chip package into the chip insertion groove. The COB-type chip package includes a printed circuit board; and an IC chip and a metal plate each of which is mounted onto the first and the second surface of the printed circuit board which are opposite to each other. In the step (a), the printed circuit board of the COB-type chip package is cut in a larger size than the metal plate of the COB-type chip package. In the step (b), the chip insertion groove of the metal card is formed with the same size as the printed circuit board of the COB-type chip package. According to the present invention, by forming a space between the main body of the metal card and the metal plate of the COB-type chip package not to touch each other, electrical insulation between the metal card and the COB-type chip package is structurally realized. |
