发明名称 |
WIRING MATERIAL AND SEMICONDUCTOR MODULE USING SAME |
摘要 |
There is provided a wiring material including a core layer made of metal and a clad layer made of metal and a fiber in which the core layer is copper or an alloy containing copper and the clad layer is formed of copper or the alloy containing copper and the fiber having a thermal expansion coefficient lower than that of copper, the wiring material having a stacked structure in which at least one surface of the core layer is closely adhered to the clad layer, and the fiber in the clad layer is arranged so as to be parallel to the surface of the core layer. |
申请公布号 |
EP2763164(A1) |
申请公布日期 |
2014.08.06 |
申请号 |
EP20120835302 |
申请日期 |
2012.08.13 |
申请人 |
HITACHI, LTD. |
发明人 |
ANDO TAKASHI;KAJIWARA RYOICHI;HOZOJI HIROSHI |
分类号 |
H01L23/14;H01L23/373;H01L23/48 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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