WIRE CUTTING TOOL COMPRISING DIFFERENT KIND OF ABRASIVE PARTICLES, AND METHOD OF FABRICATING THE SAME

摘要

The present invention relates to an wire cutting tool used to cut a cutting material with hard brittleness such as a silicon ingot, a sapphire ingot, glass, or quartz; and a manufacturing method thereof. More specifically, the wire cutting tool according to the present invention comprises: a basic material in a wire form; a first abrasive particle and a second abrasive particle located on the basic material in the wire form; an electrodeposited layer which fixates the first abrasive particle and the second abrasive particle, wherein a degree of hardness of the first abrasive particle is higher than the degree of hardness of the second abrasive particle.