| 发明名称 |
UNDERFILL COMPOSITION AND PACKAGING PROCESS USING THE SAME |
| 摘要 |
Provided is a one part liquid underfill composition comprising an epoxy resin, a latent epoxy curing agent, a photocurable resin or monomer, a photoinitiator, an optional filler, and an optional thermal initiator. Also provided is a packaging process using the underfill composition. |
| 申请公布号 |
WO2014113931(A1) |
申请公布日期 |
2014.07.31 |
| 申请号 |
WO2013CN70873 |
申请日期 |
2013.01.23 |
| 申请人 |
HENKEL IP & HOLDING GMBH;ABLESTIK (SHANGHAI) CO. LTD. |
发明人 |
HU, XIAOLONG;WYATT, DEREK;ENGLAND, JIONG;GLEESON, PAUL J.;HE, RENFEI |
| 分类号 |
C08L63/00;C08G59/40;C08L33/08;C08L33/10;H01L21/56 |
主分类号 |
C08L63/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
