| 摘要 |
<p>A microelectronic assembly (100) may include a substrate (112) having an opening (124A) extending between first and second oppositely facing surfaces (114, 116) of the substrate, the opening elongated in a first direction (L1); and at least one microelectronic element (150A) having a front face (152) facing and attached to the first surface(114) of the substrate and a plurality of contacts (156) at the front face overlying the opening, the microelectronic element having first and second opposite peripheral edges (158, 160) extending away from the front face (152). The first peripheral edge (158) extends beyond, or is aligned in the first direction with, an inner edge (144A) of the opening, and the opening extends beyond the second peripheral edge (160).</p> |
