ADHESIVE SHEET FOR SEMICONDUCTOR, AND DACING TAPE INTEGRATED ADHESIVE SHEET FOR SEMICONDUCTOR

摘要

THERE IS PROVIDED AN ADHESIVE SHEET FOR A SEMICONDUCTOR AND A DICING TAPE INTEGRATED ADHESIVE SHEET FOR A SEMICONDUCTOR THAT ARE EACH GOOD IN CUTTABILITY WHEN THE SHEETS ARE EACH CUT INTO INDIVIDUAL PIECES BY EXPANSION AND ARE EACH GOOD IN EMBEDDABILITY INTO IRREGULARITIES IN A WIRING BOARD WHEN THE SHEETS ARE EACH MOLDED THERETO. AN ADHESIVE SHEET FOR A SEMICONDUCTOR INCLUDES A RESIN COMPOSITION CONTAINING A HIGH-MOLECULAR-WEIGHT COMPONENT AND A FILLER, THE BREAKING ELONGATION OF THE ADHESIVE SHEET BEFORE CURING IS 40% OR LESS AT 0°C, AND THE ELASTIC MODULUS OF THE ADHESIVE SHEET AFTER CURING IS FROM 0.1 TO 10 MPa AT 175°C.