发明名称 THERMOPOLYMERIZATION INITIATOR SYSTEM AND ADHESIVE AGENT COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To provide an adhesive agent composition capable of binding at low temperatures for short time, excellent in connection reliability and storage stability, and to provide a thermopolymerization initiator system useful for manufacturing the adhesive agent composition.SOLUTION: There is provided an adhesive agent composition containing (A) an iodonium salt compound represented by the general formula (I), (B) a radical polymerization initiator, (C) a cationic polymerizable material and (D) a film formative polymer, and the content of a radical polymerizable vinyl compound contained in the adhesive agent composition is 0 mass% based on the total amount. (I), where Rand Rrepresent each independently a substituted or unsubstituted aryl group and Yrepresents an anionic residue.</p>
申请公布号 JP2014139328(A) 申请公布日期 2014.07.31
申请号 JP20140092811 申请日期 2014.04.28
申请人 HITACHI CHEMICAL CO LTD 发明人 KAWAKAMI SUSUMU;NAGAI AKIRA
分类号 C09J201/00;C09J7/00;C09J9/02;C09J11/04;C09J11/06;C09J129/10;C09J163/00;C09J171/00 主分类号 C09J201/00
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