SEMICONDUCTOR DEVICE

摘要

Provided is a semiconductor device in which the quality of mounting each semiconductor chip can be improved. This semiconductor device comprises: a semiconductor chip; a first electrode pad and a second electrode pad that are provided on one surface of the semiconductor chip; a first electroconductive post joined to the first electrode pad with a joining material; a plurality of second electroconductive posts joined to the second electrode pad with a joining material; and a printed circuit board that is arranged so as to oppose said one surface of the semiconductor chip, and that has formed thereon an electric circuit to which the first electroconductive post and the second electroconductive posts are to be connected. The second electroconductive post that is closer to the first electroconductive post is arranged so as to avoid a short-circuiting prevention region which is within a distance where the joining material of the first electroconductive post and the joining material of the second electroconductive post do not bind with one another.